THINNED SEMICONDUCTOR WAFER AND METHOD OF THINNING A SEMICONDUCTOR WAFER

摘要

A thinned semiconductor wafer and a method for thinning the semiconductor wafer. A semiconductor wafer is thinned from its backside to form a cavity in a central region of the backside of the semiconductor wafer. Forming the cavity also forms a ring support structure in a peripheral region of the semiconductor wafer. The ring support structure has an inner edge and an outer edge. The inner edge may be beveled or have a stepped shape.