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发明名称
配线基板、多片式配线基板、及其制造方法
摘要
申请公布号
TWI488551
申请公布日期
2015.06.11
申请号
TW101113884
申请日期
2012.04.19
申请人
日本特殊陶业股份有限公司
发明人
长谷川政美;平山聪;鬼头直树
分类号
H05K1/05;H05K3/00
主分类号
H05K1/05
代理机构
代理人
何金涂 台北市大安区敦化南路2段77号8楼;丁国隆 台北市大安区敦化南路2段77号8楼
主权项
一种配线基板,系具备:基板本体,其由陶瓷所构成,且具有俯视呈矩形之表面及背面、及位于该表面与背面之间且由位于表面侧之槽切入面及位于背面侧的破断面所构成之四边的侧面;及金属化层,其沿该基板本体之表面上的四边之侧面而形成,且俯视呈矩形框状;该配线基板之特征为:该金属化层系在基板本体的侧面侧具有倾斜面,该金属化层的表面系被镀敷膜所被覆;该基板本体之露出陶瓷而形成之水平面系位于该基板本体之每个侧面的槽切入面与该金属化层之间。
地址
日本
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