| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing liquid composition for silicon wafers which enables the achievement of both of the reduction in surface roughness (haze) of a silicon wafer, and the reduction in surface defect (LPD).SOLUTION: A polishing liquid composition for silicon wafers of the present invention comprises: 0.01-0.5 mass% of silica particles; a nitrogen-containing basic compound; and a water-soluble polymer. The water-soluble polymer includes a constitutional unit expressed by the general formula (1) below. In the water-soluble polymer, the ratio (the number of oxygen atoms originating from hydroxyl groups/the number of oxygen atoms originating from polyoxyalkylene) of the number of oxygen atoms originating from hydroxyl groups to the number of oxygen atoms originating from polyoxyalkylene is 0.8-10. The water-soluble polymer is preferably at least one kind of polymer selected from a group consisting of polyglycidol, a polygcidol derivative, polyglycerin, a polyglycerin derivative, and polyvinyl alcohol-polyethylene glycol-graft copolymer having a side chain of polyvinyl alcohol. [Chemical Formula 1] |
