发明名称 THERMOPLASTIC RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE AND MANUFACTURING METHOD FOR RESIN MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for laser direct structuring excellent in thermal conductivity, capable of forming plating properly, further excellent in mechanical strength and flowability. ! SOLUTION: There is provided a thermoplastic resin composition for laser direct structuring containing 100 pts.wt. of a resin component containing a polycarbonate resin of 60 to 100 wt.% and a styrenic resin of 40 to 0 wt.%, 5 to 20 pts.wt. of a laser direct structuring additive, 30 to 60 pts.wt. of boron nitride, and 10 to 50 pts.wt. of a glass fiber. The laser direct structuring additive contains antimony and tin and a weight ratio of the laser direct structuring additive and the boron nitride (boron nitride/laser direct structuring additive) is 2 to 7. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015108075(A) 申请公布日期 2015.06.11
申请号 JP20130251655 申请日期 2013.12.05
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 TAJIMA HIROYUKI
分类号 C08L69/00;B32B15/08;C08J7/06;C08K3/00;C08K5/49;C08K7/14;C08L25/00;C08L55/02 主分类号 C08L69/00
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