| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of the potential for detachment of a copper foil and a prepreg in response to various factors such as an external force in a transfer/storage process of a base substrate, a process of stacking build-up layers on the base substrate and the like and it is hard to handle the potential by a handling method of controlling various conditions (e.g., thickness or viscosity) of a parting agent itself. ! SOLUTION: A multilayer printed wiring board manufacturing method comprises: a first process of preparing a base substrate in which a resin layer is stacked at least on one principal surface of a metallic and tabular carrier via a parting agent layer and which is an embodiment where the metallic and tabular carrier and the resin layer are firmly fixed in partial and direct contact with each other; and a second process of stacking one and more layers of build-up layers on the resin layer of the base substrate. ! COPYRIGHT: (C)2015,JPO&INPIT |
