发明名称 |
DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION |
摘要 |
Embodiments of methods for forming a device include performing an oxidation inhibiting treatment to exposed ends of first and second device-to-edge conductors, and forming a package surface conductor to electrically couple the exposed ends of the first and second device-to-edge conductors. Performing the oxidation inhibiting treatment may include applying an organic solderability protectant coating to the exposed ends, or plating the exposed ends with a conductive plating material. The method may further include applying a conformal protective coating over the package surface conductor. An embodiment of a device formed using such a method includes a package body, the first and second device-to-edge conductors, the package surface conductor on a surface of the package body and extending between the first and second device-to-edge conductors, and the conformal protective coating over the package surface conductor. |
申请公布号 |
US2015162309(A1) |
申请公布日期 |
2015.06.11 |
申请号 |
US201314097424 |
申请日期 |
2013.12.05 |
申请人 |
VINCENT MICHAEL B.;HAYES SCOTT M. |
发明人 |
VINCENT MICHAEL B.;HAYES SCOTT M. |
分类号 |
H01L25/065;H01L23/29;H01L25/00 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
performing an oxidation inhibiting treatment to a first exposed end of a first device-to-edge conductor and a second exposed end of a second device-to-edge conductor; and forming a package surface conductor to electrically couple the first device-to-edge conductor and the second device-to-edge conductor. |
地址 |
CHANDLER AZ US |