METHOD OF USING SEPARATE WAFER CONTACTS DURING WAFER PROCESSING

摘要

Embodiments of the invention are directed towards improving on-wafer process performance and processing at increased processing fluid/wafer temperature while maintaining good process performance. A method for processing a wafer in a process chamber is described where the process chamber includes a wafer holder having first and second sets of edge grippers for independently securing the wafer at the wafer edge during processing, treating the wafer with a first processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers, treating the wafer with a second processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers, and treating the wafer with a third processing fluid while securing the wafer with the second set of edge grippers, but not with the first set of edge grippers.

主权项

1. A method for processing a wafer in a process chamber, the process chamber including a wafer holder having first and second sets of edge grippers for independently securing the wafer at the wafer edge during processing, the method comprising:
treating the wafer with a first processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers; treating the wafer with a second processing fluid while securing the wafer with the first set of edge grippers, but not with the second set of edge grippers; and treating the wafer with a third processing fluid while securing the wafer with the second set of edge grippers, but not with the first set of edge grippers.