半导体晶圆研磨装置用弹性膜之部分,申请号TW103302225D01-传众专利搜索

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发明名称	半导体晶圆研磨装置用弹性膜之部分
摘要
申请公布号	TWD168374	申请公布日期	2015.06.11
申请号	TW103302225D01	申请日期	2014.04.17
申请人	荏原制作所股份有限公司	发明人	福岛诚;安田穂积;并木计介;锅谷治;富樫真吾;山木暁
分类号	15-99	主分类号	15-99
代理机构		代理人	林志刚台北市中山区南京东路2段125号7楼
主权项
地址	日本

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