METHODS FOR PRODUCING A COVER SUBSTRATE, AND HOUSED RADIATION-EMITTING COMPONENT

摘要

The invention relates to methods for producing a cover substrate (1), to methods for producing a housed radiation-emitting component on the wafer level, and to a housed radiation-emitting component. According to the invention, a cover substrate (1) is produced, a component substrate (16) is provided in the form of a wafer with a plurality of radiation-emitting components (17), the substrates are arranged one over the other such that the substrates are connected along an interposed connection frame (15), and the housed radiation-emitting components are individualized in order to provide improved housed radiation-emitting components which are advantageously arranged in an organic material-free cavity and the functionality of which can be checked in a simplified manner prior to being individualized while still on the wafer level.