Power Conversion Apparatus

摘要

An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows . The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part . The first flow path part is formed at a position facing the side wall that forms the housing space. The power semiconductor module is inserted into the first flow path part.

主权项

1. A power conversion apparatus comprising:
a first power semiconductor module including a power semiconductor element for converting a direct current to an alternating current; a capacitor module including a capacitor element for smoothing the direct current; and a flow path forming body for forming a flow path through which a cooling refrigerant flows, wherein the flow path forming body has a first flow path forming body that forms a first flow path part for cooling the first power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module, wherein the first flow path forming body is provided on a side portion of the second flow path forming body and is integrally formed with the second flow path forming body, wherein the second flow path forming body forms a housing space for housing the capacitor module above the second flow path part, wherein the first flow path part is formed at a position facing the side wall that forms the housing space, and wherein the first power semiconductor module is inserted into the first flow path part.