| 发明名称 |
THERMAL TRANSFER CATALYTIC HEAT DISSIPATION STRUCTURE |
| 摘要 |
A thermal transfer catalytic heat dissipation structure is disclosed, which comprises a thermal conductive carrier; a heat source which disposed on a face of the thermal conductive carrier; and a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film, at least disposed on the other face of the thermal conductive carrier. A carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film is used to dissipate a heat source when a thermal conductive carrier absorbs the heat from heat source, so that the heat is effectively transferred to the ambient through the film, avoiding a thermal transfer gap with respect to the ambient (like as air). |
| 申请公布号 |
US2015159969(A1) |
申请公布日期 |
2015.06.11 |
| 申请号 |
US201414288516 |
申请日期 |
2014.05.28 |
| 申请人 |
TCY-TEC Corporation |
发明人 |
Lu Hung-Chih;Yang Chung-Pin |
| 分类号 |
F28F13/18;F28D15/00;F28F21/02 |
主分类号 |
F28F13/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermal transfer catalytic heat dissipation structure, comprising:
a thermal conductive carrier, a heat source, disposed on a face of the thermal conductive carrier; and a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film, at least disposed on the other face of the thermal conductive carrier. |
| 地址 |
Taipei City TW |
