SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME

摘要

An objective of the present invention is to provide a new peeling method and a manufacturing method for a device. When dividing an M-O-W bond (where M is a given element) by applying physical force, fluid enters the gaps to form an M-OH HO-W bond, which can promote separation because of the increase in the bond distance. A roller such as a drum roller can be used for separation. A portion of the surface of the roller may exhibit adhesiveness. For example, an adhesive tape or the like may be adhered to a portion of the surface of the roller. By rotating the roller, a layer to be peeled can be wound and separated from a substrate having an insulation surface.