发明名称 THERMOSETTING RESIN COMPOSITION AND THERMALLY CONDUCTIVE SHEET
摘要 Provided is a thermosetting resin composition, which is filled to a high density with nonmetal inorganic particles and has viscosity that results in excellent workability. The thermosetting resin composition comprises a resin component (A) and filler particles (B) dispersed in the resin component (A). The resin component (A) includes a thermosetting resin (a1), the filler particles (B) include nonmetal inorganic particles (b1) and a surface layer (b2) that covers at least a portion of the surface of the nonmetal inorganic particles, and the surface layer includes an organic material.
申请公布号 WO2015083340(A1) 申请公布日期 2015.06.11
申请号 WO2014JP05860 申请日期 2014.11.21
申请人 NAGASE CHEMTEX CORPORATION 发明人 UETSUKI, YOHEI;OI, YOSUKE;WATANABE, KOJI
分类号 C08L101/00;C08K9/04 主分类号 C08L101/00
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