基板分離方法、半導体装置の製造方法、基板分離装置、ロードロック装置、及び、基板貼り合わせ装置

摘要

A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to cach other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.