| 摘要 |
FIELD: electricity.SUBSTANCE: in this method of manufacture of chip resistors which includes formation of resistive layer by depositing with the subsequent photolithography, formation of planar contacts on the face side of the substrate, laser trimming, forming of a protective layer, sectioning of the substrate into strips, forming of end contacts according to the thin-film technology, solder application, dividing of strips into chips, planar contacts on the face side of the substrate are formed according to the thin-film technology, and planar contacts on the back side of the substrate are formed simultaneously with end contacts, the operations of heat treatment, heat aging, chip adjustment and pulse training are added. The heat treatment is performed after formation of the resistive layer; the heat aging, chip adjustment, pulse training formation, thermal and electric training are performed after dividing of strips into chips.EFFECT: improved operational properties and producibility.1 dwg |
