Noise attenuation wall

摘要

An embodiment of an apparatus is disclosed. For this embodiment of the apparatus, an interposer has first vias. First interconnects and second interconnects respectively are coupled on opposite surfaces of the interposer. A first portion of the first interconnects and a second portion of the first interconnects are spaced apart from one another defining an isolation region between them. A substrate has second vias. Third interconnects and the second interconnects are respectively coupled on opposite surfaces of the package substrate. A first portion of the first vias and a first portion of the second vias are both in the isolation region and are coupled to one another with a first portion of the second interconnects.

主权项

1. An apparatus, comprising:
an interposer having a plurality of first vias; a plurality of first interconnects and a plurality of second interconnects respectively coupled on opposite surfaces of the interposer; wherein a first portion of the plurality of first interconnects and a second portion of the plurality of first interconnects are spaced apart from one another defining an isolation region therebetween; a substrate having a plurality of second vias; a plurality of third interconnects and the plurality of second interconnects respectively coupled on opposite surfaces of the substrate; and wherein a first portion of the plurality of first vias and a first portion of the plurality of second vias are both in the isolation region and are coupled to one another with a first portion of the plurality of second interconnects; wherein each of the plurality of second vias of the first portion thereof extend to each of the opposite surfaces of the substrate and each of the plurality of second vias of the first portion thereof are coupled to one another within the substrate.