发明名称 |
Piezoelectric device and electronic apparatus |
摘要 |
A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included. |
申请公布号 |
US9054604(B2) |
申请公布日期 |
2015.06.09 |
申请号 |
US201313906683 |
申请日期 |
2013.05.31 |
申请人 |
Seiko Epson Corporation |
发明人 |
Horie Kyo |
分类号 |
H03L1/02;H03L1/04;H03B5/32;H03B1/02;H02N2/00 |
主分类号 |
H03L1/02 |
代理机构 |
Harness, Dickey & Pierce, P.L.C. |
代理人 |
Harness, Dickey & Pierce, P.L.C. |
主权项 |
1. An oscillation equipment comprising:
a vibration device including a package, the package containing an insulating substrate and a lid; a vibration element installed in the package; an oscillation circuit that drives the vibration element; a temperature compensation circuit that supplies a signal to the oscillation circuit for compensating temperature characteristics; a temperature sensor installed in the package that outputs analog temperature information; and an A/D converter that converts the analog temperature information into a digital temperature signal and that supplies the digital temperature signal to the temperature compensation circuit, wherein the lid and the temperature sensor are connected with a metal material so as to directly thermally connect the temperature sensor and the lid without any other intervening pad or terminal. |
地址 |
JP |