发明名称 |
Semiconductor device |
摘要 |
A semiconductor device includes a semiconductor substrate of a first conductivity type, a first region of a second conductivity type formed in the semiconductor substrate, a second region of the first conductivity type formed in the first region, a source region of the second conductivity type formed in the second region, a drain region of the second conductivity type formed in the first region, a first junction part including a part of a border between the first region and the second region, which is on the side of the drain region, a second junction part including a part of the border between the first region and the second region, which is at a location different from the first junction part, a gate electrode formed above the first junction, and a conductor pattern formed above the second junction part and being electrically independent from the gate electrode. |
申请公布号 |
US9054185(B2) |
申请公布日期 |
2015.06.09 |
申请号 |
US201313915088 |
申请日期 |
2013.06.11 |
申请人 |
FUJITSU SEMICONDUCTOR LIMITED |
发明人 |
Onoda Michihiro |
分类号 |
H01L29/66;H01L29/78;H01L29/06;H01L29/40;H01L27/092;H01L29/08;H01L29/10;H01L21/8238 |
主分类号 |
H01L29/66 |
代理机构 |
Westerman, Hattori, Daniels & Adrian, LLP |
代理人 |
Westerman, Hattori, Daniels & Adrian, LLP |
主权项 |
1. A semiconductor device comprising:
a semiconductor substrate of a first conductivity type; a first region of a second conductivity type opposite to the first conductivity type formed in the semiconductor substrate; a second region of the first conductivity type formed in the first region; a source region of the second conductivity type formed in the second region; a drain region of the second conductivity type formed in the first region; a first junction part that includes a part of a border between the first region and the second region, and that is on the side of the drain region; a second junction part that includes a part of the border between the first region and the second region, and that is at a location different from the first junction part; a device isolation insulation film formed in the semiconductor substrate and located on the second junction part; a gate electrode formed above the first junction; and a conductor pattern formed on the device isolation insulation film and being electrically independent from the gate electrode, the source region and the drain region. |
地址 |
Yokohama JP |