| 摘要 |
The interconnector is used for two circuits. At least one hole is made to join the two surfaces (S1,S2) of the substrate (S) and the wall is metallised by a first layer (1) from the first surface (S2) to a predetermined depth (CX2). A second metallised layer (2) is formed from the second surface (S1) to a depth (CX1) to meet the first layer. The hole is then filled by metal layers (3, 4) from either side to the depth of the first and second layers. The circuits are then manufactured on the surfaces. The different layers are made by screen printing and reheating and the layers are formed with metallic ink. In a key application, gold circuits (C1) on one surface are joined by gold metallisations (2, 3) to meet silver metallisations (1, 4) joining the silver circuits (C2). |
