发明名称 Display device having a connection area outside the display area
摘要 An object of the present invention is to provide a display device capable of narrowing the area of the frame. In order to achieve this object, the display device according to the present invention has a substrate having a plurality of arranged display elements and a wiring layer of a power source on the peripheral side; a bank layer for mutually separating the display elements; an electrode layer for covering the plurality of display elements and the bank layer; and a sealing substrate for further covering the electrode layer by joining the peripheral portion of the substrate and the sealing portion circling around the periphery via a joining element such as an adhesive; wherein the periphery of the sealing substrate is positioned inside the periphery of the substrate, and the peripheral portion of the electrode layer is connected to the wiring of the power source within the sealing portion.
申请公布号 USRE45556(E1) 申请公布日期 2015.06.09
申请号 US201313923911 申请日期 2013.06.21
申请人 SEIKO EPSON CORPORATION 发明人 Kobayashi Hidekazu;Yokoyama Osamu;Matsueda Yojiro
分类号 H05B33/04;H05B33/26;H01J1/62;H01L51/52 主分类号 H05B33/04
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 id="REI-00013" date="20150609" 1. A display device, comprising: a substrate including a plurality of display elements, a bank layer that separates each of the display elements, and a wiring layer; a common electrode layer that is spread out to the periphery of the substrate and covers said plurality of display elements and said bank layer; and a multilayer thin film for covering the substrate, wherein a flat peripheral portion of the common electrode layer is laminated to a flat top face of the wiring layer through laminated flat conductive films which form a linear electrical connection area in plane, and the connection area is continuously positioned outside of the bank layer along sides of the substrate where a wiring tape is not connected, and the multilayer thin film extends beyond the connection area of the common electrode layer and the wiring layer.
地址 Tokyo JP