Methods of manufacturing a phase change memory device

摘要

A method of manufacturing a phase change memory device includes forming a lower electrode in a cell region of a substrate and a transistor in a peripheral circuit region of the substrate. A first insulating interlayer is formed on the substrate and covers the lower electrode and the transistor. A first contact is formed to penetrate through the first insulating interlayer to connect with the transistor. A second insulating interlayer is formed on the first insulating interlayer and the first contact. A first opening and a second opening are formed by partially removing the first and second insulating interlayers. A phase change material layer pattern is formed to partially fill the first opening. A bit line is formed to fill a remaining portion of the first opening, and a wiring is formed to fill the second opening. Accordingly, the manufacturing process may be simplified.

主权项

1. A method of manufacturing a phase change memory device, comprising:
forming a lower electrode in a cell region of a substrate and a transistor in a peripheral circuit region of the substrate; forming a first insulating interlayer on the substrate, the first insulating interlayer covering the lower electrode and the transistor; forming a first contact in the peripheral circuit region, the first contact penetrating through the first insulating interlayer to make an electric connection with the transistor; forming a second insulating interlayer on the first insulating interlayer and the first contact; forming a first opening and a second opening by partially removing the first and second insulating interlayers, the first opening exposing the lower electrode and the second opening exposing the first contact; forming a phase change material layer to fill the first and second openings; partially removing the phase change material layer to form a phase change material layer pattern partially filling the first opening; and forming a bit line and a wiring, the bit line filling a remaining portion of the first opening, and the wiring filling the second opening.