Wafer-level packaged optical subassembly and transceiver module having same

摘要

A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.

主权项

1. A wafer-level packaged optical subassembly comprising:
a substrate element, the substrate element comprising a top layer and a base layer being bonded with the top layer; a top window cover being stacked on and bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements bonded directly on the base layer via conductive pads within the substrate element; wherein: at least one primary cavity is defined in the substrate element and enclosed by a first opening of the top layer, a bottom surface plane of the window cover and a top surface plane of the base layer, and configured for accommodating the active optoelectronic elements; a plurality of peripheral cavities are defined and enclosed by second openings of the top layer and the top surface plane of the base layer which are around the at least one primary cavity as alignment features for external opto-mechanical parts; and a plurality of third openings are defined on the top window cover, and each of the third openings is aligned with one of the peripheral cavities.