发明名称 FORMING METHOD OF UPWARD TYPE INFLATION FILM USING COEXTRUSION
摘要 <p>In the present invention, disclosed is a method for molding an upward inflation film without using release sheets or release films used in a manufacturing method of an existing hot melt film by coextruding carrier layers consisting of a certain resin in both surfaces wherein the method for molding the upward inflation film with middle layers molds upward inflation films by following the steps of coextruding a first carrier layer stacked on one surface of the middle layer and a second carrier layer stacked on the other surface of the middle layer wherein the middle layers consist of resins which are not used for molding films when extruding only one among the first carrier layer and the second carrier layer, the first carrier layer consists of at least one resin among low density polyethylene, middle density polyethylene and linear low density polyethylene resin, and the second carrier layer consists of at least on resin among low density polyethylene, middle density polyethylene and linear low density polyethylene, nylon, polyester and thermoplastic polyurethane.</p>
申请公布号 KR101527687(B1) 申请公布日期 2015.06.09
申请号 KR20140064093 申请日期 2014.05.28
申请人 SAMSUNG GRATECH. CO. 发明人 YOO, KI HYUN
分类号 B29C55/28;B29D7/01 主分类号 B29C55/28
代理机构 代理人
主权项
地址