LOW TEMPERATURE HEAT-SEALING PROPERTIES OF ATACTIC-POLYPROPYLENE RESIN COMPOSITION

摘要

Disclosed is a polypropylene resin composition having excellent transparency and processability, wherein a film having low temperature thermal adhesion and a soluble quantity are low so that printing properties and wetting index standing changes are low, and blending properties and processability are excellent. The polypropylene resin composition of the present invention comprises: (a) 78-98 wt% of a propylene-ethylene random copolymer containing 0.5-10 wt% of ethylene; (b) 0.5-10 wt% of ethylene; (b) 0.5-10 wt% of polyethylene polymerized using a metallocene catalyst; (c) 0.5-10 wt% of polybutene-1; and (d) 1-15 wt% of a propylene-ethylene copolymer or an atactic polypropylene polymerized using a metallocene catalyst.