发明名称 |
SUBSTRATE HOLDER SYSTEM, SUBSTRATE BONDING APPARATUS, AND DEVICE MANUFACTURING METHOD |
摘要 |
In order to integrate substrate holders respectively holding semiconductor substrates such that the semiconductor substrates arc sandwiched in a layered stale, a fixing mechanism is needed to fix the substrate holders to each other. The contact points in the fixing mechanism can generate dust. Therefore, provided is a substrate holder system comprising a first substrate holder that holds a first substrate; an engaging member provided on the first substrate holder; a second substrate holder that holds a second substrate; an engagement receiving member provided on the second substrate holder at a position facing the engaging member when the first substrate holder and the second substrate holder face each other and sandwich the first substrate and the second substrate; and a buffer portion provided on at least one of a contact portion of the engaging member and a contact portion of the engagement receiving member. |
申请公布号 |
IN1481DEN2012(A) |
申请公布日期 |
2015.06.05 |
申请号 |
IN2012DELNP1481 |
申请日期 |
2012.02.17 |
申请人 |
NIKON CORPORATION |
发明人 |
SUGAYA, ISAO;CHONAN, JUNICHI;MAEDA, HIDEHIRO |
分类号 |
H01L21/683 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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