| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which allows a highly efficient bonding operation without requiring increase in transport speed of a suction collet (head).SOLUTION: A bonding device which picks up chips from a chip supply member arranged at one supply member arrangement position by using a pair of suction collets and bond the chips to bonded members arranged at positions of a pair of bonded member arrangement positions, respectively, comprises: the pair of suction collets for picking up chips; transport means for making the second suction collet be in a state of being transported to the one bonded member arrangement position in a state where the first suction collet is transported to the supply member arrangement position, and making the first suction collet be in a state of being transported to the other bonded member arrangement position in a state where the second suction collet is transported to the supply member arrangement position; and lifting means for lifting up and down the suction collets. |
