| 发明名称 |
LIQUID COMPRESSION MODLING ENCAPSULANTS |
| 摘要 |
Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials. |
| 申请公布号 |
US2015152260(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201514615570 |
申请日期 |
2015.02.06 |
| 申请人 |
Henkel lP & Holding GmbH |
发明人 |
Bai Jie |
| 分类号 |
C08L63/00;H01L21/77 |
主分类号 |
C08L63/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermosetting resin composition, comprising a thermosetting resin matrix, a block copolymer, a silica filler and a cure component comprising the combination of an anhydride or a phenolic resin and an imidizole. |
| 地址 |
Duesseldorf DE |
