THREE-DIMENSIONAL MOUNTING METHOD AND THREE-DIMENSIONAL MOUNTING DEVICE

摘要

A three-dimensional mounting method for sequentially layering N number of chips provided with electrodes on both vertical surfaces thereof onto a substrate provided with an electrode, with the positions of the electrodes in an aligned state, said three-dimensional mounting method involving: when layering a first chip onto the substrate, recognizing and aligning substrate alignment positions and lower-surface alignment positions inscribed on the lower surface of the first chip by using a dual-perspective image recognition means, and storing the positional coordinates of the substrate alignment positions; when joining the nth+1 chip onto the nth chip for which 1 ≤ n ≤ N-1, recognizing and aligning upper-surface alignment positions inscribed on the upper surface of the nth chip and lower-surface alignment positions inscribed on the lower surface of the nth+1 chip by using the dual-perspective image recognition means, and recognizing and storing the positional coordinates of the upper-surface alignment positions of the nth chip; and after layering the Nth uppermost-layer chip, recognizing the upper-surface alignment positions inscribed on the upper surface of the Nth chip and storing the positional coordinates thereof.