| 摘要 |
<p>The present invention relates to a method for manufacturing a light emitting diode (LED) module having an LED package integratively molded thereon and an LED module thereby which can remove a lead frame applied to a substrate of an LED package when manufacturing an LED module by directly mounting a plurality of LED chips integratively on the substrate of the LED module on which the LED chips manufactured in package form are to be mounted, eliminate an additional manufacturing process for manufacturing the LED package, eliminate a installation process for installing the LED package on the LED module after manufacturing the LED package, and maintain an identical and uniform shape of a lens unit and improve light emitting efficiency of the LED module by integratively molding the lens unit which is a mixture of an epoxy mold compound (EMC) resin and a fluorescent material (phosphor) on each LED chip after mounting the LED chip on the substrate of the LED module. The method for manufacturing an LED module according to the present invention comprises: a step of forming at least one LED chip mounting unit on a substrate formed of a printed circuit board (PCB) or a metal substrate; a step of die bonding an LED chip on the LED chip mounting unit; a step of wire bonding the LED chip on a positive polarity terminal and a negative polarity terminal of the substrate; a step of molding a molding material on the LED chip of the LED chip mounting unit to integratively form a plurality of lens units; and a step of hardening the lens units.</p> |
