| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film forming method which suppresses an increase in a required time for forming a thin film, and can form a thin film of which unevenness on a surface is reduced.SOLUTION: A first thin film part is formed by landing a liquid-like thin film material on a substrate and then curing the landed thin film material to a first degree of curing. A second thin film part is formed by landing the liquid-like thin film material so as to partially overlap with the first thin film part and then curing the newly landed thin film material to a second degree of curing. After a boundary between the first thin film part and the second thin film part becomes unidentifiable, the first thin film part and the second thin film part are cured to a third degree of curing higher than the first degree of curing and the second degree of curing. |
