发明名称 CHIP TYPE ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a chip type electronic component that is able to improve workability for mounting, by eliminating the need for directivity for mounting while improving self-alignment in solder mounting. ! SOLUTION: In an element assembly 2, the width of a pair of first sides 2b in the direction in which they face and the width of a pair of second sides 2c in the direction in which they face are almost identical. Each terminal electrode 5 includes: a first electrode portion 5a arranged on an end face 2a; a pair of second electrode portions 5b connected to the first electrode portions 5a and arranged on the pair of first sides 2b; and a pair of third electrode portions 5c connected to the first electrode portions 5a and arranged on the pair of second sides 2c. The second electrode portions 5b and third electrode portions 5c are located apart from each other. Between the second electrode portions 5b and third electrode portions 5c, ridges 3c formed by the first sides 2b and second sides 2c a
申请公布号 JP2015103554(A) 申请公布日期 2015.06.04
申请号 JP20130240900 申请日期 2013.11.21
申请人 TDK CORP 发明人 INAGAKI TATSUO ; WATANABE MASAKI ; SUGIURA YU ; KON SHINTARO ; KANEKO YUKIO
分类号 H01G4/252;H01G4/232;H01G4/30 主分类号 H01G4/252
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