发明名称 |
ADHESIVE PATTERN FOR ADVANCE PACKAGE RELIABILITY IMPROVEMENT |
摘要 |
The present disclosure relates to an integrated chip package having a plurality of different adhesive layers that provide for a low lid induced stress good warpage control of a substrate and/or IC die, and an associated method of formation. The integrated chip package has an integrated chip (IC) die coupled to an underlying substrate by an electrically conductive interconnect structure. A first adhesive layer, having a first Young's modulus, is disposed onto the substrate at a first plurality of positions surrounding the IC die. A second adhesive layer, having a second Young's modulus different than the first Young's modulus, is disposed onto the substrate at a second plurality of positions surrounding the IC die. A lid is affixed to the substrate by the first and second adhesive layers and extends to a position overlying the IC die. |
申请公布号 |
US2015155221(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
US201314093856 |
申请日期 |
2013.12.02 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Chen Chin-Liang;Lin Wei-Ting;Ho Kuan-Lin;Liu Yu-Chih;Lin Chun-Cheng;Lin Shih-Yen |
分类号 |
H01L23/433;H01L23/00;H01L23/16;H01L23/02;H01L21/52;H01L21/56 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
1. An integrated chip (IC) package, comprising:
an integrated chip (IC) die coupled to an underlying substrate by a plurality of electrically conductive bonding structures; a first adhesive layer having a first Young's modulus and disposed onto the substrate at a first plurality of positions surrounding the IC die; a second adhesive layer having a second Young's modulus, different than the first Young's modulus, and disposed onto the substrate at a second plurality of positions surrounding the IC die; and a lid affixed to the substrate by the first and second adhesive layers and configured to extend to a position overlying the IC die. |
地址 |
Hsin-Chu TW |