| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which prevents formation of a crown when patterning a thick photoresist.SOLUTION: A semiconductor device manufacturing method comprises the steps of: preparing a jig 4 having a recess 5 for mounting a semiconductor wafer 1 and an outer frame part 6 having a surface lying on an extended line of a surface of the semiconductor wafer when mounted; and coating a thick photoresist on the semiconductor wafer in a state of being mounted on the jig. At this time, a crown is to be formed on the jig and a thickness of the photoresist on the semiconductor wafer becomes uniform. Subsequently, exposure and developing are performed in a state where the semiconductor wafer is mounted on the jig. Due to developing, the jig and the semiconductor wafer can be separated. |
