发明名称 ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT, AND METHOD FOR USING ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT
摘要 Provided is an adhesive sheet for temporary fixing use, which cannot come off or cannot be detached even when an electronic material on a thin film is fixed temporarily onto a hard substrate using the adhesive tape and then the resultant product is subjected to an etching treatment or the like in an electronic component production process. An adhesive sheet for temporarily fixing an electronic component, which comprises a base material and an adhesive agent layer formed from a cured product of an adhesive agent composition and provided on both surfaces or one surface of the base material, said adhesive sheet being characterized in that the adhesive agent composition comprises at least a component (A) that is a silyl-terminal polymer, a component (B) that is a silane coupling agent and a component (C) that is a curing catalyst, the component (A), i.e., the silyl-terminal polymer, has a specific structure, and a component (D) that is an adhesiveness-imparting resin may be additionally contained or may not be contained in the adhesive agent composition wherein the amount of the component (D), i.e., the adhesiveness-imparting resin, is less than 10 parts by weight relative to 100 parts by weight of the component (A), i.e., the silyl-terminal polymer, when the component (D) is contained.
申请公布号 WO2015079904(A1) 申请公布日期 2015.06.04
申请号 WO2014JP79846 申请日期 2014.11.11
申请人 LINTEC CORPORATION 发明人 YAMAGUCHI SEITARO;NAKAYAMA HIDEKAZU;OTAKA SYO;MIYATA SOU;KAWADA SATOSHI
分类号 C09J7/02;B32B27/00;C09J11/06;C09J175/08;C09J183/00 主分类号 C09J7/02
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