| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which enables mounting achieving high connection reliability with a semiconductor element by mounting the semiconductor element on the wiring board with high accuracy.SOLUTION: A wiring board A on which multiple semiconductor element connection pads 2a each having a flat top face are formed to be arranged in a lattice shape on a square mounting part 1a of an insulating substrate 1 having the mounting part 1a on which the semiconductor element S is mounted on a top face, in a state where the top faces of the semiconductor element connection pads 2a are exposed comprises: at least three first dummy pads 2b arranged on a central part of the mounting part 1a so as to surround the center of the mounting part and adjacent to each other; at least one second dummy pad 2c formed on each of four corners of the mounting part 1a; and a dummy solder bump H1 having a first height is formed on the first and second dummy pads 2b, 2c. |
