RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC DEVICE USING THE SAME

摘要

The present invention provides a resin composition for encapsulating electronic elements that contains a phenol resin curing agent, an epoxy resin, and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C.; a resin composition for encapsulating electronic components that contains an epoxy resin and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C.; and a resin composition for encapsulating electronic components that contains a phenol resin curing agent, an epoxy resin, and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C., in which a glass transition temperature (Tg) of a cured material of the encapsulating resin composition is equal to or higher than 200° C., and when the cured material is heated for 1,000 hours at 200° C. in the atmosphere, a weight reduction rate of the cured material becomes equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition.

主权项

1. A resin composition for encapsulation comprising:
a phenol resin curing agent represented by Formula (1A); an epoxy resin represented by Formula (2A); and a release agent of which a 5% weight reduction temperature is equal to or higher than 240° C., (in Formula (1A), each of two Ys independently represents a hydroxyphenyl group represented by Formula (1B) or Formula (1C); X represents a hydroxyphenylene group represented by Formula (1D) or Formula (1E); and n represents a number equal to or greater than 0. When n is equal to or greater than 2, each of two or more Xs may be independently the same as or different from each other; each of R1s independently represents a hydrocarbon group having 1 to 5 carbon atoms; and a represents an integer of 0 to 4), (in Formulae (1B) to (1E), each of R2 and R3 independently represents a hydrocarbon group having 1 to 5 carbon atoms; b represents an integer of 0 to 4; c represents an integer of 0 to 3; d represents an integer of 0 to 3; and e represents an integer of 0 to 2), (in Formula (2A), each of two Ys independently represents a glycidylated phenyl group represented by Formula (2B) or Formula (2C); X represents a glycidylated phenylene group represented by Formula (2D) or Formula (2E); and n represents a number equal to or greater than 0. When n is equal to or greater than 2, each of two or more Xs may be independently the same as or different from each other; each of R1s independently represents a hydrocarbon group having 1 to 5 carbon atoms; and a represents an integer of 0 to 4), (in Formulae (2B) to (2E), each of R2 and R3 independently represents a hydrocarbon group having 1 to 5 carbon atoms; b represents an integer of 0 to 4; c represents an integer of 0 to 3; d represents an integer of 0 to 3; and e represents an integer of 0 to 2).