发明名称 SEMICONDUCTOR MODULE AND DRIVER DEVICE
摘要 A semiconductor module includes a switching element, a molded body, and a motor terminal. The molded body having the switching element disposed therein. The motor terminal has a base portion and a connection portion having an insertion hole into which a motor wire is inserted and connected with the winding wire. The connection portion has a cutaway region that defines a slot. The winding wire of the motor and the semiconductor module are connected via the motor wire and the motor terminal, thereby reducing the number of components used for such connection compared with a connection that uses a connector, and achieving a volume reduction of the semiconductor module and a driver device using the same.
申请公布号 US2015155762(A1) 申请公布日期 2015.06.04
申请号 US201414553025 申请日期 2014.11.25
申请人 DENSO CORPORATION 发明人 HIRAMINE Mikihiro;FUJITA Toshihiro
分类号 H02K11/00;H01L23/50 主分类号 H02K11/00
代理机构 代理人
主权项 1. A semiconductor module comprising: a switching element switching an electric current supplied to a winding wire of a motor; a molded body having the switching element disposed therein; and a motor terminal having a base portion and a connection portion, the base portion protruding from the molded body, and the connection portion disposed on a tip side of the base portion and having an insertion hole into which a motor wire is inserted to be connected with the winding wire, wherein the connection portion has a cutaway region that defines a slot, and the slot is connected to the insertion hole and expands outwardly from the insertion hole.
地址 Kariya-city JP