PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition showing good cleaning property in an unexposed part with an aqueous developer and excellent shape stability with time in an unexposed photosensitive resin structure.SOLUTION: The photosensitive resin composition includes a hydrophilic component in a particulate state present in a hydrophobic component, and the photosensitive resin composition comprises: 100 parts by mass of a hydrophobic polymer; 20 parts by mass or more and 300 parts by mass or less of a hydrophilic polymer; 10 parts by mass or more and 80 parts by mass or less of an ethylenically unsaturated monomer; 0.2 parts by mass or more and 20 parts by mass or less of a photopolymerization initiator; and 0.2 parts by mass or more and 15 parts by mass or less of a surfactant. The surfactant is present in the hydrophilic polymer.