发明名称 |
Electronic device incorporating a randomized interconnection layer |
摘要 |
An electronic device incorporating a randomized interconnection layer. In one example, the device includes a randomized interconnection layer having a randomized conductive pattern formed by etching of a heterogeneous layer; and a sensing circuit, electrically coupled to the randomized interconnection layer to detect the randomized conductive pattern. In another example, a method of fabricating the device includes forming a set of electrodes proximate to a silicon substrate; depositing a heterogeneous layer of elements onto the substrate; etching the heterogeneous layer to form a randomized conductive pattern; and electrically coupling the electrodes to a sensing circuit and the randomized conductive pattern. |
申请公布号 |
EP2876680(A3) |
申请公布日期 |
2015.06.03 |
申请号 |
EP20140192633 |
申请日期 |
2014.11.11 |
申请人 |
NXP B.V. |
发明人 |
IN T' ZANDT, MICHAEL ANTOINE ARMAND;NGUYEN, VIET HOANG |
分类号 |
H01L23/58;G06F21/55;H04L9/32 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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