Method of fabricating interconnect structure for package-on-package devices

摘要

An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.

主权项

1. A method of forming a semiconductor device, the method comprising:
forming a protective layer over a carrier substrate; forming through vias extending up from the protective layer; attaching one or more dies to the protective layer; forming a molding compound between the through vias and the one or more dies; electrically coupling electrical connectors to the through vias and electrical contacts on the one or more dies; debonding the carrier substrate and exposing the protective layer; and after the debonding, forming openings in the protective layer to expose the through vias.