Solder paste, joining method using the same and joined structure

摘要

A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference, i.e. a difference in between the lattice constant of the intermetallic compound and the lattice constant of the second metal component, of 50% or greater.

主权项

1. A solder paste comprising:
a metal component comprising a first metal, a second metal having a melting point higher than that of the first metal, and a flux component, wherein the first metal is one of Sn and an alloy containing Sn, and the second metal is one of a metal and alloy that reacts with the first metal to form an intermetallic compound having a melting point of 310° C. or higher and a lattice constant difference of 50% or greater, wherein a ratio of the second metal to the metal component is 36.9% by volume or greater.