Apparatus to improve internal wafer temperature profile

摘要

Some embodiments relate to methods and apparatus for providing a homogeneous wafer temperature profile in a wafer cleaning tool without introducing unwanted particles onto the wafer. In some embodiments, a disclosed wafer cleaning tool has a processing chamber configured to house a semiconductor wafer. A dispensing arm provides a high temperature cleaning solution to the semiconductor wafer. A heating cup is located within the processing chamber at a position that is around the perimeter of the semiconductor wafer. The heating cup generates heat that increases the temperature of outer edges of the semiconductor wafer by a greater amount than a temperature of a center of the semiconductor wafer, thereby homogenizing an internal temperature profile of the semiconductor wafer.

主权项

1. A wafer cleaning tool, comprising:
a processing chamber configured to house a semiconductor wafer; a dispensing arm configured to provide a high temperature cleaning liquid onto a center of the semiconductor wafer; a heating element configured to increase a temperature of the high temperature cleaning liquid prior to providing it to the dispensing arm; and a heating cup located within the processing chamber at a position that is around a perimeter of the semiconductor wafer and configured to radiate heat from multiple areas surrounding the perimeter to increase a temperature of outer edges of the semiconductor wafer by a greater amount than a temperature of the center of the semiconductor wafer.