发明名称 Composite micromechanical component and method of fabricating the same
摘要 The invention relates to a method of fabricating a composite micromechanical component, particularly for timepiece movements, including steps: a) providing a substrate including a horizontal top layer and a horizontal bottom layer made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, horizontal, intermediate layer; b) etching a pattern in the top layer through to the intermediate layer, thereby forming at least one cavity in the substrate; c) coating the top part of the substrate with an electrically insulating coating; d) directionally etching the coating and the intermediate layer to limit the presence thereof exclusively at each vertical wall; e) performing an electrodeposition by connecting the electrode to the conductive bottom layer of the substrate to form at least one metal part of the component; g) releasing the composite component from the substrate.
申请公布号 US9045333(B2) 申请公布日期 2015.06.02
申请号 US201012797389 申请日期 2010.06.09
申请人 Nivarox-FAR S.A. 发明人 Cusin Pierre;Thiebaud Jean-Philippe
分类号 B23P15/00;C03C25/00;B44C1/00;B81C99/00;B81C1/00;B81B3/00;C25D1/20;G04B13/02;G04D3/00;C25D1/00;C25D5/02 主分类号 B23P15/00
代理机构 Griffin & Szipl, P.C. 代理人 Griffin & Szipl, P.C.
主权项 1. A method of fabricating a composite micromechanical component including the following steps: a) providing a substrate that includes a horizontal top layer and a horizontal bottom layer made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, horizontal, intermediate layer; b) etching at least one pattern in the top layer through to the intermediate layer, so as to form at least one cavity in the substrate that will form at least one part, made of micromachinable material, of the composite component; c) coating the top part of said substrate with an electrically insulating coating; d) directionally etching said coating and said intermediate layer so as to limit the presence thereof exclusively at each vertical wall formed in the top layer; e) performing an electrodeposition by connecting the electrode to the conductive bottom layer of the substrate to form at least one metal part of the composite component; f) releasing the composite component from the substrate.
地址 Le Locle CH