Sealed crystal oscillator and semiconductor package including the same

摘要

A semiconductor package includes a package substrate; an integrated circuit chip formed on one surface of the package substrate; and a sealed quartz oscillator formed on at least one of an inside, one surface, and the other surface of the package substrate, wherein the sealed quartz oscillator includes a substrate, a quartz blank formed on one surface of the substrate, and a sealing cap covering at least one surface of the quartz blank and including metal.

主权项

1. A semiconductor package comprising:
a package substrate; an integrated circuit chip disposed on one surface of the package substrate; and a sealed quartz oscillator disposed on at least one of an interior portion and a first exterior surface of the package substrate, wherein the sealed quartz oscillator includes a substrate, a quartz blank disposed on one surface of the substrate, and a sealing cap covering at least one surface of the quartz blank, wherein the sealing cap comprises metal, wherein the sealed quartz oscillator further comprises a plurality of electrode patterns electrically connected to the quartz blank disposed on the substrate, and a plurality of through-electrodes electrically connected to the plurality of electrode patterns disposed through the substrate, respectively, and wherein at least one of the plurality of through-electrodes is positioned on a side surface or an upper surface of the quartz blank.