Die seal ring and method of forming the same

摘要

A die seal ring is provided. The die seal ring includes a substrate and a first layer extruding from the substrate. The first layer has a first fin ring structure and a layout of the first fin ring structure has a stamp-like shape. In addition, a method for forming a die seal ring is provided. A substrate having an active region is provided. A patterned sacrificial layer is formed on the substrate. A spacer is formed on the sidewall of the patterned sacrificial layer. The patterned sacrificial layer is removed. The substrate is patterned by using the spacer as a mask, thereby simultaneously forming at least a fin structure of a Fin-FET and a first layer of the die seal ring.

主权项

1. A die seal ring, comprising:
a substrate; and a first layer in contact with and extruding from an uppermost surface of the substrate, wherein the first layer has a first fin ring structure and a layout of the first fin ring structure has a stamp-like shape, wherein the first layer comprises a same semiconductor material as the substrate.