用于低热膨胀应用之可再加工的环氧树脂及固化性掺合物;REWORKABLE EPOXY RESIN AND CURATIVE BLEND FOR LOW THERMAL EXPANSION APPLICATIONS

摘要

本发明系揭示一可固化组成物，其包括：一环氧树脂；及一胺固化组份，其包括：一芳香族胺固化剂；及一助溶剂，其包括：一脂肪族胺、一环脂肪族胺、一非挥发性一级醇、非挥发性溶剂或其等之混合物。亦揭示一电子组装，其包括：一基片；一底胶，其包括该可固化组成物在该基片上之固化产物；及一在该底胶上之球栅式阵列构装。; and an amine curing component including: an aromatic amine curing agent; and a solubilizer including an aliphatic amine, a cycloaliphatic amine, a non-volatile primary alcohol, non-volatile solvent or a mixture thereof. An electronic assembly including: a substrate; an underfill including a cured product of the curable composition on the substrate; and a ball grid array on the underfill is also disclosed.