CARRIER PLATE FOR MANUFACTURING SEMICONDUCTOR CHIP

摘要

Disclosed herein is a carrier plate for manufacturing a semiconductor chip, the carrier plate including: a chip holding region provided in a predetermined region of the carrier plate and in which a plurality of through holes for inserting and fixing semiconductor chips into and to a metal plate are formed; and an adsorption region provided in an outer part of the chip holding region and used for an adsorption and fixing by an adsorption pad, wherein a plurality of uneven grooves for increasing adhesion between a base (the metal plate) and silicon are formed in an upper 15 surface and a lower surface of the adsorption region. According to the preferred embodiments of the present invention, a surface of an adsorption region of an outer chip holding region of a carrier plate is processed in an uneven 20 structure by using a half etching method other than a conventional entire etching method, thereby enhancing adhesion between a base (plate) and a silicon of the carrier plate when the silicon is formed.