发明名称 Electrically Conductive Laminate Structures
摘要 Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure, and an opening may extend through the insulative material to a portion of the laminate structure. Electrically conductive material may be within the opening and in electrical contact with at least one of the non-graphene regions of the laminate structure. Some embodiments include methods of forming electrical interconnects in which non-graphene material and graphene are alternately formed within a trench to form nested non-graphene and graphene regions.
申请公布号 US2015145135(A1) 申请公布日期 2015.05.28
申请号 US201514611514 申请日期 2015.02.02
申请人 Micron Technology, Inc. 发明人 Sandhu Gurtej S.
分类号 H01L23/532;H01L21/768 主分类号 H01L23/532
代理机构 代理人
主权项 1. An electrical interconnect, comprising: an electrically conductive laminate structure; the laminate structure comprising multiple regions nested within one another; one of said nested regions being a graphene region and others of the nested regions being non-graphene regions; the graphene region being sandwiched between a pair of non-graphene regions; the laminate structure comprising an uppermost surface that contains segments of the graphene region and of the non-graphene regions; at least one of the non-graphene regions being electrically conductive; an electrically insulative material over the upper surface of the laminate structure, and having an opening extending therethrough to a portion of the laminate structure; said portion differing from other portions of the laminate structure by having space between the pair of non-graphene regions instead of having graphene between the non-graphene regions; and electrically conductive material within the opening and within the space.
地址 Boise ID US
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