发明名称 |
EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME |
摘要 |
A reconstituted wafer includes a rigid mass with a flat surface and a base surface disposed parallel planar to the flat surface. A plurality of dice are embedded in the rigid mass. The plurality of dice include terminals that are exposed through coplanar with the flat surface. A process of forming the reconstituted wafer includes removing some of the rigid mass to expose the terminals, while retaining the plurality of dice in the rigid mass. A process of forming an apparatus includes separating one apparatus from the reconstituted wafer. |
申请公布号 |
US2015145138(A1) |
申请公布日期 |
2015.05.28 |
申请号 |
US201514614687 |
申请日期 |
2015.02.05 |
申请人 |
Intel Corporation |
发明人 |
Sankman Robert L.;Guzek John S. |
分类号 |
H01L25/065;H01L23/31;H01L21/3105;H01L25/00;H01L21/56 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Santa Clara CA US |