| 发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE |
| 摘要 |
Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.0 |
| 申请公布号 |
US2015147849(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201414527733 |
申请日期 |
2014.10.29 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SHIN Yee Na;Hwang Young Nam;Kwon Hyun Bok;Woo Seung Wan |
| 分类号 |
H01L23/31;H01L23/00;H01L23/48;H01L21/82 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a semiconductor package, comprising:
preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip. |
| 地址 |
Suwon-Si KR |
